Hillock-free aluminum thin films for electronic devices-Reference-Cited by-同舟云学术

Hillock-free aluminum thin films for electronic devices

Published:1971-03 Issue:3 Volume:2 Page:691-697
ISSN:0360-2133
Container-title:Metallurgical Transactions
language:en
Short-container-title:MT

Author:

Sato K.,Oi T.,Matsumaru H.,Okubo T.,Nishimura T.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/BF02662723.pdf

Reference19 articles.

1. P. G. Shewmon:Diffusion in Solids, p. 111, McGraw-Hill, New York, 1963.

2. M. S. Anand and R. P. Agarwala:Trans. TMS-AIME, 1967, vol. 239, p. 1848.

3. D. McLean:Grain Boundaries in Metals, p. 116, Oxford University Press, New York, 1957.

4. R. L. Eadie and K. T. Aust:Scripta Met., 1970, vol. 4, p. 641.

5. A. D. Paddock and J. R. Black:Electrochem. Soc. Extended Abstract, no. 98, p. 247, Spring, 1968.

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