Electron beam processing of interconnection structures in multi-layer ceramic modules-Reference-Cited by-同舟云学术

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Electron beam processing of interconnection structures in multi-layer ceramic modules

Published:1971-03 Issue:3 Volume:2 Page:729-731
ISSN:0360-2133
Container-title:Metallurgical Transactions
language:en
Short-container-title:MT

Author:

Koste Walter W.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/BF02662728.pdf

Reference2 articles.

1. B. Schwartz and D. L. Wilcox:Laminated Ceramic, Proceedings, Electronic Components Conference, 1967, Washington, D. C.

2. B. W. Schulmacher:A Review of the Laws for Electron Penetration through Matter, First International Conference on Electron and Ion Beam Science and Technology, R. Bakisch, ed., John Wiley & Sons, 1965.

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electron beam machining of ceramic green-sheets for multilayer ceramic electronic packaging applications;Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms;1993-07

2. Electron Beam Techniques;Microelectronic Packaging;1979

3. Printing and laminating;Multilayered Low Temperature Cofired Ceramics (LTCC) Technology

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