Wettability modification of polystyrene surface by cold atmospheric pressure plasma jet-Reference-Cited by-同舟云学术

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Wettability modification of polystyrene surface by cold atmospheric pressure plasma jet

Published:2022-01-07 Issue:2 Volume:300 Page:103-110
ISSN:0303-402X
Container-title:Colloid and Polymer Science
language:en
Short-container-title:Colloid Polym Sci

Author:

Bakhshzadmahmoudi M.,Jamali S.,Ahmadi E.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Colloid and Surface Chemistry,Polymers and Plastics,Physical and Theoretical Chemistry

Link

https://link.springer.com/content/pdf/10.1007/s00396-021-04928-0.pdf

Reference31 articles.

1. Lieberman MA, Lichtenberg AJ (1994) Principles of plasma discharges and materials processing. Wiley, New York

2. Smith RW, Wei D, Apelian D (1989) Thermal plasma materials processing applications and opportunities. Plasma Chem Plasma Process 9(1):135S-165S

3. Jeong JY et al (1998) Etching materials with an atmospheric-pressure plasma jet. Plasma Sources Sci Technol 7(3):282

4. Yoshihisa K et al (2013) Hydrophilic modification of plastic surface by using microwave plasma irradiation. IHI Engineering Review 46(1):29–33

5. Pawlat J, Samon R, Henryka D, Diatczyk J, Gizewski T (2013) RF-powered atmospheric pressure plasma jet for surface treatment. Eur Phys J Appl Phys 61:24322

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2. Investigation of the effect of mass percentage concentration of polystyrene–toluene solution on the surface properties of the plasma‐treated polystyrene thin films;Polymer Engineering & Science;2024-08-09

3. Influence of O2 content on surface modification of epoxy resin using He/CF4 atmospheric pressure plasma jet to improve surface flashover strength;Physics of Plasmas;2024-08-01

4. Novel self-assembled graphene oxide coating by atmospheric pressure plasma jet;Materials Science in Semiconductor Processing;2024-06

5. Experimental study of the influence of O₂ content on electrical and optical characteristics of He/CF₄ APPJ;Journal of Physics D: Applied Physics;2024-05-07

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