Design of a two-phase loop thermosyphon for telecommunications system (I)

Author:

Kim Won Tae,Song Kyu Sub,Lee Young

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering

Reference17 articles.

1. Adami, M. and Yimer, B., 1988, “Development and Evaluation of an Planar Heat Pipe for Cooling Electronic System,”Proc. of ASME Nat. Heat Transfer Conf., pp. 499–507.

2. Chi, S. W., 1976, Heat Pipe Theory and Practice: A Sourcebook, McGraw-Hill, New York.

3. Chu, R. C. and Simons R. E., 1994, “Cooling Technology for High Performance Computers: Design Applications, Cooling of Electronic Systems,” NATO ASI Series E: Applied Science Vol. 258. Edited by Kakac et al., pp. 71–95. Kluwer Academic Publishers.

4. Faghri, A., 1995,Heat Pipe Science and Technology, Taylor & Francis. Washington, DC.

5. Hewitt, G. F., Shiress, G. L., and Bott, T. R., 1994,Process Heat Transfer, CRC Press, London.

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