A configurable analog buffer dedicated to a wafer-scale prototyping platform
Author:
Publisher
Springer Science and Business Media LLC
Subject
Surfaces, Coatings and Films,Hardware and Architecture,Signal Processing
Link
http://link.springer.com/content/pdf/10.1007/s10470-014-0442-6.pdf
Reference16 articles.
1. Norman, R., Valorge, O., Blaquière, Y., Lepercq, É., Basile-Bellavance, Y., El-Alaoui, Y., Prytula, R., & Savaria, Y. (2008). An active reconfigurable circuit board. In NEWCAS-TAISA conference (pp. 351–354). Montreal.
2. Laflamme-Mayer, N., Blaquière, Y., & Sawan, M. (2011). A dual-rail, low-dropout, fast response linear regulator dedicated to a wafer-scale electronic systems prototyping platform. In NEWCAS conference (pp. 438–451). Bordeaux.
3. Laflamme-Mayer, N., André, W., Valorge, O., Blaquière, Y., & Sawan, M. (2013). Configurable input-output power pad for wafer-scale microelectronic systems. IEEE Transactions on Very Large Scale Integration (TVLSI), 21(11), 2024–2033.
4. Lepercq, É., Valorge, O., Basile-Bellavance, Y., Laflamme-Mayer, N., Blaquière, Y., & Savaria, Y. (2009). An interconnection network for a novel reconfigurable circuit board. In The 2 nd Microsystems and Nanoelectronics Research Conference (MNRC) (pp. 53–56). Ottawa.
5. Lu, C.-W., Yin, P.-Y., Hsia, C.-M., Frank Chan, M.-C., & Lin, Y.-S. (2012). A 10-bit resistor-floating-resistor-string DAC (RFR-DAC) for high color-depth LCD driver ICs. IEEE Journal of Solid-State Circuits, 47(10), 2454–2466.
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