Author:
Jadav Sunil,vashishath Munish,Chandel Rajeevan
Publisher
Springer Science and Business Media LLC
Subject
Surfaces, Coatings and Films,Hardware and Architecture,Signal Processing
Reference18 articles.
1. Kumar, V. R., Kaushik, B. K., & Majumder, M. K. (2014). Graphene based on-chip interconnects and TSVs: Prospects and challenges. IEEE Nanotechnology Magazine,
8(4), 14–20.
2. Majumder, M. K., Kukkam, N. R., & Kaushik, B. K. (2014). Frequency response and bandwidth analysis of multi-layer graphene nanoribbon and multi-walled carbon nanotube interconnects. IET Micro & Nano Letters,
9(9), 557–560.
3. Agrawal, Y., Girish Kumar, M., & Chandeel, R. (2016). A novel unified model for copper and MLGNR interconnects using voltage and current mode signalling scheme. In IEEE transactions on electromagnetic compatibility.
4. Agrawal, Y., Girish Kumar, M., & Chandeel, R. (2016). Comprehensive model for high speed current mode signalling in next generation MWCNT bundle interconnect using FDTD technique. IEEE Transactions on Nanotechnology,
15(4), 590–598.
5. Kumar, V. R., Majumder, M. K., Alam, A., Kukkam, N. R., & Kaushik, B. K. (2015). Stability and delay analysis of multi-layered GNR and multi-walled CNT interconnects. Journal of Computational Electronics,
14(2), 611–618.
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