Investigation on the combined effects of variable Fermi energies and temperatures on the performance of multilayer graphene nanoribbon as interconnects-Reference-Cited by-同舟云学术

Investigation on the combined effects of variable Fermi energies and temperatures on the performance of multilayer graphene nanoribbon as interconnects

Published:2020-06-23 Issue:2 Volume:104 Page:157-168
ISSN:0925-1030
Container-title:Analog Integrated Circuits and Signal Processing
language:en
Short-container-title:Analog Integr Circ Sig Process

Author:

Sharma Himanshu^ORCID,Sandha Karmjit Singh

Publisher

Springer Science and Business Media LLC

Subject

Surfaces, Coatings and Films,Hardware and Architecture,Signal Processing

Link

https://link.springer.com/content/pdf/10.1007/s10470-020-01681-2.pdf

Reference28 articles.

1. Dennard, R. H., Gaensslen, F. H., Rideout, V. L., Bassous, E., & LeBlanc, A. R. (1974). Design of ion-implanted MOSFET's with very small physical dimensions. IEEE Journal of Solid-State Circuits,9(5), 256–268.

2. Sze, S. M., & Ng, K. K. (2006). Physics of semiconductor devices. New Jersy: Wiley.

3. Rossnagel, S. M., & Kuan, T. S. (2004). Alteration of Cu conductivity in the size effect regime. Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena,22(1), 240–247.

4. Steinhögl, W., Schindler, G., Steinlesberger, G., Traving, M., & Engelhardt, M. (2005). Comprehensive study of the resistivity of copper wires with lateral dimensions of 100 nm and smaller. Journal of Applied Physics,97(2), 023706-1–023706-7.

5. Ogawa, E. T., Lee, K. D., Blaschke, V. A., & Ho, P. S. (2002). Electromigration reliability issues in dual-damascene Cu interconnections. IEEE Transactions on Reliability,51(4), 403–419.

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