Load-balance scheduling for intelligent sensors deployment in industrial internet of things-Reference-Cited by-同舟云学术

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Load-balance scheduling for intelligent sensors deployment in industrial internet of things

Published:2021-06-21 Issue: Volume: Page:
ISSN:1386-7857
Container-title:Cluster Computing
language:en
Short-container-title:Cluster Comput

Author:

Sah Dinesh Kumar,Nguyen Tu N.,Cengiz Korhan,Dumba Braulio,Kumar Vikas

Publisher

Springer Science and Business Media LLC

Subject

Computer Networks and Communications,Software

Link

https://link.springer.com/content/pdf/10.1007/s10586-021-03316-1.pdf

Reference67 articles.

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2. Do, D., Nguyen, M.V., Nguyen, T.N., Li, X., Choi, K.: Enabling multiple power beacons for uplink of noma-enabled mobile edge computing in wirelessly powered IOT. IEEE Access 8, 148892–148905 (2020)

3. Le, N.T., Wang, J., Le, D.H., Wang, C., Nguyen, T.N.: Fingerprint enhancement based on tensor of wavelet subbands for classification. IEEE Access 8, 6602–6615 (2020)

4. Liwen, H., Nguyen, N.-T., Tao, W., Leu, M.C., Liu, X.F., Shahriar, Md R.S.M., Nahian A.S.: Modeling of cloud-based digital twins for smart manufacturing with MT connect. Procedia Manufacturing, 26:1193–1203, : 46th SME North American Manufacturing Research Conference, NAMRC 46. Texas (2018)

5. Shahriar, M.R., Sunny, S.M.N.A., Liu, X., Leu, M.C., Hu, L., Nguyen N.: Mtcomm based virtualization and integration of physical machine operations with digital-twins in cyber-physical manufacturing cloud. In 2018 5th IEEE International Conference on Cyber Security and Cloud Computing (CSCloud)/2018 4th IEEE International Conference on Edge Computing and Scalable Cloud (EdgeCom), pages 46–51, 2018

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