Thermal performance analysis of LED with multichips

Author:

Han Yuanyuan,Guo Hong,Zhang Ximin,Yin Fazhang,Chu Ke,Fan Yeming

Publisher

Springer Science and Business Media LLC

Subject

General Materials Science

Reference13 articles.

1. Steigerwald D A, Bhat J C, Collins D, et al. Illumination with Solid State Lighting Technology[J]. IEEE Journal of Selected Topics in Quantum Electronics, 2002, 8(2): 310–320

2. Zweben C. Advances in LED Packaging and Thermal Management Materials[J]. SPIE, 2008, 6910: 1 801–1 811

3. Su A, Liu Y C and Chen C Y. Thermal Diffusion Analysis for LED Module[J]. Heat Transfer-Asian Research, 2007, 36(8): 449–458

4. Kim L and Choi J. Thermal Analysis of Multi-chip LED Packages[J]. SPIE, 2006, 6355E: 1–8

5. Tang M H, Wu T H and Su G D. External Efficiency and Thermal Reliability Enhanced Multi-Chip Package Design for Light Emitting Diodes[J]. SPIE, 2008, 7058Q: 1–11

Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Refined simulation of temperature distribution in molds during autoclave process;Iranian Polymer Journal;2016-08-08

2. Convection Condition Variation Analysis on Thermal Dissipation of High Power Single Chip LED;Advanced Materials Research;2014-12

3. Thermal Simulation Analysis of High Power LED with Varied Heat Sink Fin Design;Advanced Materials Research;2014-12

4. Stress and Temperature Simulation Using Copper-Diamond Composite Slug;2013 UKSim 15th International Conference on Computer Modelling and Simulation;2013-04

5. Solid State Lighting Stress and Junction Temperature Evaluation on Operating Power;2013 UKSim 15th International Conference on Computer Modelling and Simulation;2013-04

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3