Author:
Han Yuanyuan,Guo Hong,Zhang Ximin,Yin Fazhang,Chu Ke,Fan Yeming
Publisher
Springer Science and Business Media LLC
Subject
General Materials Science
Reference13 articles.
1. Steigerwald D A, Bhat J C, Collins D, et al. Illumination with Solid State Lighting Technology[J]. IEEE Journal of Selected Topics in Quantum Electronics, 2002, 8(2): 310–320
2. Zweben C. Advances in LED Packaging and Thermal Management Materials[J]. SPIE, 2008, 6910: 1 801–1 811
3. Su A, Liu Y C and Chen C Y. Thermal Diffusion Analysis for LED Module[J]. Heat Transfer-Asian Research, 2007, 36(8): 449–458
4. Kim L and Choi J. Thermal Analysis of Multi-chip LED Packages[J]. SPIE, 2006, 6355E: 1–8
5. Tang M H, Wu T H and Su G D. External Efficiency and Thermal Reliability Enhanced Multi-Chip Package Design for Light Emitting Diodes[J]. SPIE, 2008, 7058Q: 1–11
Cited by
6 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献