Improvement of AlN Thermal Conductivity Based on Reductive Compound Additives
Author:
Publisher
Springer Science and Business Media LLC
Subject
General Materials Science
Link
https://link.springer.com/content/pdf/10.1007/s11595-023-2791-4.pdf
Reference35 articles.
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3. Chung D D L. Materials for Thermal Conduction[J]. Applied Thermal Engineering, 2001, 21(16): 1593–1605
4. Frear D. Packaging Materials[M]. Cham: Springer International Publishing, 2017
5. Ding W, Xu J, Chen Z, et al. Effects of Heating Temperature on Interfacial Microstructure and Compressive Strength of Brazed CBN-AlN Composite Abrasive Grits[J]. Journal of Wuhan University of Technology-Mater. Sci. Ed., 2010, 25(6): 952–956
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