1. T. Hattori, Detection and Identification of Particles on silicon Surfaces, Particles on Surfaces, Detection, Adhesion, and Removal, Edited by K.L. Mittal, Marcel Dekker, Inc., New York.
2. K. W. Tobin, S. S. Gleason, F. Lakhami, and M. H. Bennet, (1997) Automated Analysis for Rapid Defect Sourcing and Yield Learning. Future Fab International, Vol. 4.
3. The National Technology Roadmap for Semiconductors, Semiconductor Industry Association, San Jose, 2001.
4. M. M. Slama, M. H. Bennett, and P. W. Fletcher, (1992) Advanced In-Line Process Control of Defects. Integrated Circuit Metrology, Inspection, and Process Control VI, SPIE vol. 1673, p. 496.
5. B. Trafas, M. H. Bennet, M. Godwin, (1995) Meeting Advanced Pattern Inspection System Requirements for 0.25-μm Technology and Beyond. Microelectronic Manufacturing Yield Reliability, and Failure Analysis, SPIE vol. 2635, p. 50.