Fabrication of microcapsule particles by electrospray and their use as latent curing agent for epoxy resin
Author:
Funder
Trường Đại Học Thủ Dầu Một
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Polymers and Plastics,General Chemical Engineering
Link
https://link.springer.com/content/pdf/10.1007/s13726-023-01205-5.pdf
Reference35 articles.
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2. Satdive A, Mestry S, Borse P, Mhaske S (2020) Phosphorus- and silicon-containing amino curing agent for epoxy resin. Iran Polym J 29:433–443
3. Mi X, Liang N, Xu H, Wu J, Jiang Y, Nie B, Zhang D (2022) Toughness and its mechanisms in epoxy resins. Prog Mater Sci 130:100977
4. Shundo A, Yamamoto S, Tanaka K (2022) Network formation and physical properties of epoxy resins for future practical applications. JACS Au 2:1522–1542
5. Hsu YG, Lin KH, Lin TY, Fang YL, Chen SC, Sung YC (2012) Properties of epoxy-amine networks containing nanostructured ether-crosslinked domains. Mater Chem Phys 132:688–702
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