Effect of bonding temperatures on the transient liquid phase bonding of a directionally solidified Ni-based superalloy, GTD-111-Reference-Cited by-同舟云学术

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Effect of bonding temperatures on the transient liquid phase bonding of a directionally solidified Ni-based superalloy, GTD-111

Published:2007-02 Issue:1 Volume:13 Page:59-65
ISSN:1598-9623
Container-title:Metals and Materials International
language:en
Short-container-title:Met. Mater. Int.

Author:

Lee Bong Keun,Song Woo Young,Kim Dae Up,Woo In Su,Kang Chung Yun

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/BF03027824.pdf

Reference7 articles.

1. D. U. Kim and K. Nishimoto, Met. Mater.-Int. 8, 403 (2002).

2. K. B. Gove, Joining Technology, p. 342, Metals and Materials, USA (1989).

3. K. H. Richter, Brazing High Temperature Brazing and Diffusion Welding, 5th, p. 7–10, DVS, German (1998).

4. M. H. Haafkens, Weld J. 25, 61 (1982).

5. Nakao, Weld Tech. 64, 35 (1987).

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