Laser micro-cladding electronic pastes for fabrication of MIM thick film capacitors
Author:
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
http://link.springer.com/content/pdf/10.1007/s12200-009-0008-x.pdf
Reference9 articles.
1. King B. Maskless mesoscale materials deposition. Electronic Packaging and Production, 2003, 43(2): 18–20
2. Colvin J, Carter M, Puszynski J, Sears J. Laser sintering of silver nano-particle inks deposited by direct write technology. In: Proceedings of 24th International Congress on Applications of Lasers and Electro-Optics, Scottsdale, AZ, USA. 2005, 369–374
3. Zeng X Y, Li X Y, Liu J W, Qi X J. Direct fabrication of electric components on insulated boards by laser microcladding electronic pastes. IEEE Transactions on Advanced Packaging, 2006, 29(2): 291–294
4. Li H L, Zeng X Y, Li H F. Study on thick film resistor and electrode fabricated by laser micro-cladding electronic pastes. Surface and Coatings Technology, 2006, 200(24): 6832–6839
5. Li H L, Zeng X Y. Study on the structure and properties of thick-film capacitors fabricated by laser micro-cladding and rapid prototype. Journal of Materials Processing Technology, 2007, 184(1–3): 184–189
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