Modelling and analysis of the bonding mechanism of CBN grains for electroplated superabrasive tools—part 1: introduction and application of a novel approach for determining the bonding force and the failure modes-Reference-Cited by-同舟云学术

Modelling and analysis of the bonding mechanism of CBN grains for electroplated superabrasive tools—part 1: introduction and application of a novel approach for determining the bonding force and the failure modes

Published:2014-10-03 Issue:9-12 Volume:76 Page:2051-2058
ISSN:0268-3768
Container-title:The International Journal of Advanced Manufacturing Technology
language:en
Short-container-title:Int J Adv Manuf Technol

Author:

Li Xuekun,Wolf Sebastian,Zhu Tianxing,Zhi Geng,Rong Yiming

Publisher

Springer Science and Business Media LLC

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Software,Control and Systems Engineering

Link

http://link.springer.com/content/pdf/10.1007/s00170-014-6411-5.pdf

Reference6 articles.

1. Merbecks T (2003) Entwicklung eines Charakterisierungsverfahrens für keramische gebundene CBN Schleifscheiben. Dissertation RWTH Aachen

2. Klocke F (2009) Manufacturing processes 2: grinding, honing, lapping. Springer, Berlin

3. Denkena B, Tönshoff HK (2011) Spanen: grundlagen, 3rd edn. Springer, Heidelberg

4. Klocke F, Merbecks T (2002) Charakterisierung von keramisch gebundenen cBN-Schleifscheiben. In: Industrial Diamond Review. 3

5. Klocke F, Merbecks T (2002) Charakterisierung von keramisch gebundenen cBN-Schleifscheiben. In: Industrial Diamond Review. 4

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