Force modeling of microscale grinding process incorporating thermal effects-Reference-Cited by-同舟云学术

Force modeling of microscale grinding process incorporating thermal effects

Published:2008-12-02 Issue:5-6 Volume:44 Page:476-486
ISSN:0268-3768
Container-title:The International Journal of Advanced Manufacturing Technology
language:en
Short-container-title:Int J Adv Manuf Technol

Author:

Park Hyung Wook,Liang Steven Y.

Publisher

Springer Science and Business Media LLC

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Software,Control and Systems Engineering

Link

http://link.springer.com/content/pdf/10.1007/s00170-008-1852-3.pdf

Reference30 articles.

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2. Kopalinsky EM, Oxley PLB (1984) Size effects in metal removal processes. Inst Phys Conf Ser 70:389–396 Oxford, Engl

3. Hahn RS, Lindsay RP (1982a) Principles of grinding part 1. The metal removal parameter. Grinding: theory, techniques and trouble shooting. SME 3–10

4. Hahn RS, Lindsay RP (1982b) Principles of grinding part 2. The metal removal parameter. Grinding: theory, techniques and trouble shooting. SME 11–17

5. Hahn RS, Lindsay RP (1982c) Principles of grinding part 3. The wheel removal parameter. Grinding: theory, techniques and trouble shooting. SME 18–24

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