Contrastive deep clustering for detecting new defect patterns in wafer bin maps
Author:
Funder
Korea Institute for Advancement of Technology
National Science Foundation of Korea
Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s00170-023-12939-0.pdf
Reference31 articles.
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3. Tong LI, Wang CH, Chen DL (2007) Development of a new cluster index for wafer defects. Intl J Adv Manuf Technol 31:705–715. https://doi.org/10.1007/s00170-005-0240-5
4. Wang, J., Chun, H., Kim, J., & Lee, C. (2023). Wafer particle inspection technique using computer vision based on color space transform model. Intl J Adv Manuf Technol. https://doi.org/10.1007/s00170-023-11888-y
5. Jang J, Seo M, Kim CO (2020) Support weighted ensemble model for open set recognition of wafer map defects. IEEE Trans Semicond Manuf 33(4):635–643. https://doi.org/10.1109/TSM.2020.3012183
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