Thermal experiments and analysis on adhesive cleaning of work-holding devices by grinding

Abstract

AbstractIn the light-activated work-holding devices, hardened adhesive residues on the fixture plate need to be removed to make it available for the subsequent work holding. There are several ways to remove the cured adhesive from the gripper, such as laser-based degradation, and softening and removing with high temperature pressured water wash. These processes are associated with the generation of carbon black, affecting transparency which compromises the efficiency of the light-activated device. A novel peripheral grinding-based cleaning process has been developed to strip the adhesive from the fixture plate. The present research is aimed to analyze the effect of variation in grinding parameters, viz., spindle speed, feed, depth of cut, and the grain size of the grinding wheel on the temperature of the adhesive being ground and cleaning of the adhesive-filled channel. Aggressive values of grinding parameters are selected to achieve the desired removal of adhesive, putting a step towards sustainability. Moreover, a comprehensive investigation of the temperature of the grinding zone and the grinding wheel is made by inspecting the effective cleaning of the cured adhesive-filled channel. Higher values of spindle speed (11.57 m/s) and feed (0.406 mm/rev) resulted in an improved, cleaned surface of the ground adhesive-filled channel. Moreover, the grinding wheel with a more prominent grain size (46/Ø 0.35 mm) and porosity was proved to be more effective in the cleaning process by reducing and maintaining the grinding temperature (~52 °C) of the adhesive-filled channel.