Author:
Zeng Yibo,Zhang Jie,Zhou Hui,Guo Hang
Publisher
Springer Science and Business Media LLC
Subject
Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Software,Control and Systems Engineering
Reference45 articles.
1. Tohoda S, Fujishima D, Yano A, Ogane A, Matsuyama K, Nakamura Y, Tokuoka N, Kanno H, Kinoshita T, Sakata H, Taguchi M, Maruyama E (2012) Future directions for higher-efficiency hit solar cells using a thin silicon wafer. J Non-Cryst Solids 358(17):2219–2222.
https://doi.org/10.1016/j.jnoncrysol.2012.03.025
2. Feil M, Adler C, Hemmetzberger D, Konig M (2004) The challenge of ultra thin chip assembly, in: The 54th Electronic Components and Technology onference, Las Vegas, USA, June 1–4, 2004, pp 35–40
3. Burghartz JN, Graf HG, Harendt C, Klingler W (2006) HDR CMOS imagers and their applications, in: the 8th IEEE Conference Conference on Solid-State and Integrated Circuit Technology (ICSICT 2006), Shanghai, China, October 23–26, 2006, pp 528–531
4. Burghartz JN, Engelhardt T, Graf HG, Harendt C (2008) CMOS imager technologies for biomedical applications, in: the IEEE Conference on 2008 Solid-State Circuits (ISSCC 2008), San Francisco, USA, February 3–7, 2008, pp 141-142, 602
5. Feng Z, Chen X (2007) Image processing of grinding wheel surface. Int J Adv Manuf Technol 32(1–2):27–33.
https://doi.org/10.1007/s00170-005-0319-Z
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