Author:
Wang Gou-Jen,Wang Ming-Tzong,Yang Feng-Cheng,Huang Min-Liang,Loh Kou-Ning,Chen Jacob
Publisher
Springer Science and Business Media LLC
Subject
Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Software,Control and Systems Engineering
Reference32 articles.
1. Lakshminaryanan S (1994) Dual-Damascene copper metallization process using chemical mechanical polishing. Proceedings of the 11th International VLSI Multilevel Interconnection Conference, pp 49–55
2. Jackson R, Broadbent E (1998) Processing and integration of copper interconnects. Solid State Technol 41(3):49
3. Wang CR, Lin CF, Lin BY edit (1998) CMP Technique, Quan Hua. [Text in Chinese]
4. Torres J (1999) Cu dual damascene for advanced metallisation (0.18 /spl mu/m and beyond). Proceedings of the 1999 IEEE Interconnect Technology, International Conference, pp 253 –255
5. Wang GJ, Chou MH (2005) A neural-Taguchi-based quasi time-optimization control strategy for chemical-mechanical polishing processes. Int J Adv Manuf Technol 26(7–8):759–765
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