Numerical simulation and optimization of fine-blanking process for copper alloy sheet

Author:

Kuo Chun-Chih,Liu Kuo-Wang,Li Tse-Chang,Wu Dai-You,Lin Bor-Tsuen

Abstract

AbstractWhen the fine-blanking process is used, secondary grinding or processing can be omitted because the shear surface of fine-blanking parts can achieve almost zero fracture zone requirements. The primary objective of the fine-blanking process is to reduce the fracture zone depth and die roll zone width. This study used a 2.5-mm-thick central processing unit (CPU) thermal heat spreader as an example. Finite element analysis software was employed to simulate and optimize the main eight process parameters that affect the fracture zone depth and die roll zone width after fine-blanking: the V-ring shape angle, V-ring height of the blank holder, V-ring height of the cavity, V-ring position, blank holder force, counter punch force, die clearance, and blanking velocity. Simulation analysis was conducted using the L18 (21 × 37) Taguchi orthogonal array experimental combination. The simulation results of the fracture zone depth and die roll zone width were optimized and analyzed as quality objectives using Taguchi’s smaller-the-better design. The analysis results revealed that with fracture zone depth as the quality objective, 0.164 mm was the optimal value, and counter punch force made the largest contribution of 25.89%. In addition, with die roll zone width as the quality objective, the optimal value was 1.274 mm, and V-ring height of the cavity made the largest contribution of 29.45%. Subsequently, this study selected fracture zone depth and die roll zone width as multicriteria quality objectives and used the robust multicriteria optimal approach and Pareto-optimal solutions to perform multicriteria optimization analysis. The results met the industry’s fraction zone depth standard (below 12% of blank thickness) and achieved a smaller die roll zone width.

Publisher

Springer Science and Business Media LLC

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Software,Control and Systems Engineering

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