Feasibility of the 248 nm Excimer laser in the laser structuring of fine circuit lines on printed circuit board-Reference-Cited by-同舟云学术

Feasibility of the 248 nm Excimer laser in the laser structuring of fine circuit lines on printed circuit board

Published:2006-05-03 Issue:11-12 Volume:33 Page:1149-1158
ISSN:0268-3768
Container-title:The International Journal of Advanced Manufacturing Technology
language:en
Short-container-title:Int J Adv Manuf Technol

Author:

Zhang Bin,Yung K. C.

Publisher

Springer Science and Business Media LLC

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Software,Control and Systems Engineering

Link

http://link.springer.com/content/pdf/10.1007/s00170-006-0564-9.pdf

Reference18 articles.

1. Vaucher C, Jaquet R (2002) Laser direct imaging and structuring. http://www.circuitree.com . Cited 10 April 2006

2. Tadic E (2000) Hair’s breadth structures for future product designs. SMT 1–2:12

3. Partha A, Zemel M, Jain K (2001) A comparison of PCB imaging technologies. Proceedings of the technical conference of IPC printed circuits EXPO, Anaheim, CA, S–15–02, April 2001

4. Terliuc G, Benron H (2000) Thermal direct imaging and HDI- advanced registration accuracy and high yields with conventional DES process. Proceedings of the technical conference of IPC printed circuits EXPO, San Diego, CA, S12–3, April 2000

5. Wheeler JA (2002) Laser direct imaging a solution for fine line imaging. Proceedings of the technical conference of IPC printed circuits EXPO, Long Beach, CA, S03–4, March 2002

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Evaluation of thermal characteristics of laser induced heating of microfilm in relation to printed circuit board manufacturing;Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering;2022-08-01

2. Femtosecond Laser Machining of Flexible Printed Circuit Boards;Journal of Physics: Conference Series;2022-01-01

3. Areal Surface Texture Parameters for Copper/Glass Plating Adhesion Characteristics;Measurement Science Review;2021-02-01

4. Analysis of sonic waves generated during laser engraving of printed circuits;The International Journal of Advanced Manufacturing Technology;2008-06-12

5. Optimisation of direct laser structuring of printed circuit boards;Applied Surface Science;2008-06