Author:
Davies P. D.,Davies H. M.,Watkins I.,Britton D. A.
Abstract
AbstractPowder interlayer bonding (PIB) is a joining technique originally developed to enable high-integrity repairs of aerospace components. The technique has previously been employed for the joining of titanium and nickel alloys utilised in the aerospace industry. This study expands on the application of the novel joining technique known as powder interlayer bonding (PIB), to the bonding of γ titanium aluminide (TiAl) material. PIB has been used to facilitate high-integrity joints in gamma titanium aluminides (TiAl), where full densification of the joint was achieved. The PIB technique described here used a metallic powder interlayer between the two faying surfaces of γ TiAl specimens. Bonds were formed in an inert atmosphere under induction heating. The PIB technique proved capable of producing high-integrity bonds in terms of microstructural evaluation, with very limited porosity retained after the bonding cycle. A brittle Ti2Al phase can be produced with heavily oxidised powder which is susceptible to cracking and will negatively affect mechanical properties.
Funder
Engineering and Physical Sciences Research Council
Publisher
Springer Science and Business Media LLC
Subject
Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Software,Control and Systems Engineering
Cited by
3 articles.
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