Investigation on thermal stress–induced bending of copper foil using pulsed arc plasma
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Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s00170-024-14349-2.pdf
Reference23 articles.
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2. Wu MY, Li XP, Dong HL, Yu SH, Li LX (2019) High-performance flexible dielectric tunable BTS thin films prepared on copper foils. CERAM INT 45(13):16270–16274
3. Huang D, Man JX (2020) Laser shock induced deformation of copper foil on diverse molds and the cross-sectional microstructure changes. Coatings 10(12):1264
4. Wang X, Ma YJ, Shen ZB, Gu YX, Zhang D, Qiu TB, Liu HX (2015) Size effects on formability in microscale laser dynamic forming of copper foil. J MATER PROCESS TECH 220:173–183
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