Groove bottom material removal mechanism and machinability evaluation for longitudinal ultrasonic vibration–assisted milling of Al-50wt% Si alloy-Reference-Cited by-同舟云学术

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Groove bottom material removal mechanism and machinability evaluation for longitudinal ultrasonic vibration–assisted milling of Al-50wt% Si alloy

Published:2023-05-12 Issue:1-2 Volume:127 Page:365-380
ISSN:0268-3768
Container-title:The International Journal of Advanced Manufacturing Technology
language:en
Short-container-title:Int J Adv Manuf Technol

Author:

Jing Lu,Niu Qiulin,Yue Wenhui,Rong Jie,Gao Hang,Tang Siwen

Funder

National Natural Science Foundation of China

Education Department of Hunan Province

Hunan Postgraduate Research Innovation Project Fund

Publisher

Springer Science and Business Media LLC

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Software,Control and Systems Engineering

Link

https://link.springer.com/content/pdf/10.1007/s00170-023-11548-1.pdf

Reference39 articles.

1. Zhang W, Ding D, Gao P (2016) High volume fraction Si particle-reinforced aluminium matrix composites fabricated by a filtration squeeze casting route. Mater Des 90:834–838. https://doi.org/10.1016/j.matdes.2015.11.033

2. Wang S, Fu M, Li X, Wang J, Su X (2018) Microstructure and mechanical properties of Al-Si eutectic alloy modified with Al-3P master alloy. J Mater Process Technol 255:105–109. https://doi.org/10.1016/j.jmatprotec.2017.12.008

3. Niu QL, Li S, Chen YN, Li CP, Li SJ, Ko TJ, Li PN, Chen M, Qiu XY (2022) A constitutive model of Al/50wt%Sip composites considering particle damage effects. Mater Sci Eng A Struct 836:142726. https://doi.org/10.1016/j.msea.2022.142726

4. Cai ZG, Wang RC, Zhang C, Peng CQ, Yan F, Wang LQ (2015) Thermal cycling reliability of Al/50Sip composite for thermal management in electronic packaging. J Mater Sci Mater Electron 26:4894–4901. https://doi.org/10.1007/s10854-015-2999-y

5. Cai ZY, Zhang C, Wang RC, Peng CQ, Wu X, Li HP (2018) High-temperature mechanical properties and thermal cycling stability of Al-50Si alloy for electronic packaging. Mater Sci Eng A Struct 728:95–101. https://doi.org/10.1016/j.msea.2018.05.020

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