1. Kim SK, Lee S (1997) On heat sink measurement and characterization. Proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference (INTERPACK’97), Hawaii, June 1519
2. Biber CR, Belady CL (1997) Pressure drop prediction for heat sinks: what is the best method? Proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference (INTERPACK’97), Hawaii, June, 1519
3. Rao T (2001) Fundamentals of microelectronic packaging. McGraw-Hill, New York
4. Shih CJ, Liu GC (2004) Optimal design methodology of plate-fin heat sinks for electronic cooling using entropy generation strategy. Comp Packag Tech IEEE Trans 27(3):551–559
5. Shah A, Sammakia B, Srihari H (2002) A numerical study of the thermal performance of an impingement heat sink fin shape optimization. ITHERM 2002:298–306