WEDM one-step preparation of miniature heat sink with superhydrophobic and efficient heat transfer performance-Reference-Cited by-同舟云学术

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WEDM one-step preparation of miniature heat sink with superhydrophobic and efficient heat transfer performance

Published:2023-06-02 Issue:3-4 Volume:127 Page:1873-1885
ISSN:0268-3768
Container-title:The International Journal of Advanced Manufacturing Technology
language:en
Short-container-title:Int J Adv Manuf Technol

Author:

Li Zhaolong,Li Wangwang,Xun Meng,Yuan Mengchen

Funder

Supported by Opening Project of the Key Laboratory of Advanced Processing Technology and Intelligent Manufacturing

National Natural Science Foundation of China

Publisher

Springer Science and Business Media LLC

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Software,Control and Systems Engineering

Link

https://link.springer.com/content/pdf/10.1007/s00170-023-11679-5.pdf

Reference30 articles.

1. Li XL, Sheng MJ, Gong S, Wu H, Chen XL, Lu X, Qu JP (2022) Flexible and multifunctional phase change composites featuring high-efficiency electromagnetic interference shielding and thermal management for use in electronic devices. Chem Eng J 430(2):132928. https://doi.org/10.1016/j.cej.2021.132928

2. Yu M, Zhu J (2023) Hotspot thermal management of silicon-based high power hetero-integration. Int J Heat Mass Transf 203:123790. https://doi.org/10.1016/j.ijheatmasstransfer.2022.123790

3. Lv WJ, Li JJ, Chen M (2023) Experimental study on the thermal management performance of a power battery module with a pulsating heat pipe under different thermal management strategies. Appl Therm Eng 227:120402. https://doi.org/10.1016/j.applthermaleng.2023.120402

4. He ZQ, Yan YF, Zhang ZE (2021) Thermal management and temperature uniformity enhancement of electronic devices by miniature heat sinks: a review. Energy 216:119223. https://doi.org/10.1016/j.energy.2020.119223

5. Peng LQ, Yu HT, Chen C, He QX, Zhang H, Zhao FL, Qin MM, Feng YY, Feng W (2023) Tailoring dense, orientation-tunable, and interleavedly structured carbon-based heat dissipation plates. Adv Sci 10:2205962. https://doi.org/10.1002/advs.202205962

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