Equipment Used in CMP Processes-Reference-Cited by-同舟云学术

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Equipment Used in CMP Processes

Published:2004 Issue: Volume: Page:133-165
ISSN:0933-033X
Container-title:Chemical-Mechanical Planarization of Semiconductor Materials
language:
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Author:

Tucker Thomas

Publisher

Springer Berlin Heidelberg

Link

http://link.springer.com/content/pdf/10.1007/978-3-662-06234-0_5

Reference49 articles.

1. H. Hocheng, Y.-L. Huang and L.-J. Chen, Journal Of The Electrochemical Society, 146 (11), 4236, November 1999.

2. D. White, D. Boning and A. Gower, Proceedings 2000 CMP—MIC Conference, 229, IMIC, Tampa, 2000.

3. W. Patrick, W. Guthrie, C. Standley and P. Schiable, Journal Of The Electrochemical Society, 138 (6), 1778, June 1991.

4. H. Hocheng and 11.-Y. Tsai, Proceedings 1997 CMP—MIC Conference, 277, IMIC, Tampa, 1997.

5. R. Kolenkow and R. Nagahara, Solid State Technology, 35 (6), 112, June 1992.

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