1. See also: S. Wolf and R.N. Tauber, “Silicon Processing for the VLSI Era”, vols. 1–3, Lattice Press, Sunset Beach, CA, 1990–2000; S.M. Sze, “VLSI Processing”, Wiley, New York, 1988.
2. N. Elbel, B. Neureither, B. Ebersberger and P. Lahnor, J. Electrochem. Soc., 145, 1659, (1998).
3. T. Park, T. Tugbawa, J. Yoon, D. Boning, J. Chung, R. Muralidhar, S. Hymes, Y. Gotkis, S. Alamgir, R. Walesa, L. Shumway, G. Wu, F. Zhang, R. Kistler and J. Hawkins, Proceedings 1998 VMIC Conference, 437, IMIC, Tampa, 1998.
4. E.K. Broadbent and C.L. Ramiller, J. Electrochem. Soc., 131, 1427, 1984.
5. See also: “Tungsten and Other Refractory Metals for VLSI Applications”, parts I-IV, MRS, Pittsburg, PA, 1985–1988.