Tensile-Compress Fatigue Behavior of Solder Joints
Author:
Publisher
Springer Berlin Heidelberg
Link
http://link.springer.com/content/pdf/10.1007/978-3-662-48823-2_3
Reference37 articles.
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3. Seah SKW, Wonga EH, Shim VPW. Fatigue crack propagation behavior of lead-free solder joints under high-strain-rate cyclic loading. Script Mater. 2008;59:1239–42.
4. Erinc M, Assman TM, Schreurs PJG, Geers MGD. Fatigue fracture of SnAgCu solder joints by microstructural modeling. Int J Fract. 2008;152:37–49.
5. Zhu QS, Zhang ZF, Shang JK, Wang ZG. Fatigue damage mechanisms of copper single crystal/Sn-Ag-Cu interfaces. Mater Sci Eng A. 2006;435–436:588–94.
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