Problems Related to X-Ray Stress Analysis in Thin Films in the Presence of Gradients and Texture-Reference-Cited by-同舟云学术

Problems Related to X-Ray Stress Analysis in Thin Films in the Presence of Gradients and Texture

Published:2004 Issue: Volume: Page:473-503
ISSN:0933-033X
Container-title:Diffraction Analysis of the Microstructure of Materials
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Author:

Genzel C.

Publisher

Springer Berlin Heidelberg

Link

http://link.springer.com/content/pdf/10.1007/978-3-662-06723-9_18

Reference66 articles.

1. I.C. Noyan and J.B. Cohen: Residual Stress Measurement by Diffraction and Interpretation. (Springer, Berlin Heidelberg New York 1987)

2. B. Scholtes: Eigenspannungen in mechanisch randschichtverformten Werkstoffen. Ursachen, Ermittlung und Bewertung. (DGM Informationsgesellschaft, Oberursel 1991)

3. V. Hauk: Structural and Residual Stress Analysis by Nondestructive Methods. (Elsevier, Amsterdam 1997)

4. L.H. Schwartz and J.B. Cohen: Diffraction from Material. (Springer, Berlin Heidelberg New York Tokyo 1987)

5. E. Klockholm: IBM J. Res. Develop. 31, 585 (1987)

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