Copper thin films prepared by chemical vapour deposition from copper (II) acetylacetonate-Reference-Cited by-同舟云学术

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Copper thin films prepared by chemical vapour deposition from copper (II) acetylacetonate

Published:1995-11 Issue:21 Volume:30 Page:5551-5553
ISSN:0022-2461
Container-title:Journal of Materials Science
language:en
Short-container-title:JOURNAL OF MATERIALS SCIENCE

Author:

Maruyama T.,Shirai T.

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/BF00351572.pdf

Reference9 articles.

1. D. Peterson, “Non-Vacuum deposition Techniques for Use in Fabricating Thin Film Circuits”, No. NObsr 91336, Final Report (1967).

2. G. D. Kuznetozo, A. A. Babed-Zakhryapin and V. F. Gvozd, Protection Metals 8 (1972) 565.

3. T. Maruyama and Y. Ikuta, J. Mater. Sci. 28 (1993) 5540.

4. P. Powlyk, US Pat. 2704 728 (1955).

5. F. E. Drummond, US Pat. 2881 514 (1978).

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