Interfacial transient thermal fracture of adhesively bonded dissimilar materials
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,Aerospace Engineering
Link
http://link.springer.com/content/pdf/10.1007/BF02321414.pdf
Reference26 articles.
1. Williams, M.L., “The Stresses Around a Fault or Crack in Dissimilar Media,”Bull. Seismol. Soc. Amer.,49,199–204 (1959).
2. Erdogan, F., “Stress Distribution in Bonded Dissimilar Materials With Cracks,”J. Appl. Mech.,E32,403–410 (1965).
3. England, A.H., “A Crack Between Dissimilar Media,”J. Appl. Mech.,E32,400–402 (1965).
4. Rice, J.R. andSih, G.C., “Plane Problems of Cracks in Dissimilar Media,”J. Appl. Mech.,E 32,418–423 (1965).
5. Comninou, M., “The Interface Crack,”J. Appl. Mech.,E44,631–636 (1977).
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