A new computational approach for three-dimensional singular stress analysis of interface voids
Author:
Funder
National Natural Science Foundation of China
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Computational Mechanics
Link
http://link.springer.com/content/pdf/10.1007/s00707-020-02842-0.pdf
Reference52 articles.
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3. Wang, M., Beyerlein, I.J., Zhang, J., Han, W.Z.: Defect-interface interactions in irradiated Cu/Ag nanocomposites. Acta. Mater. 160, 211–223 (2018)
4. Wang, M., Beyerlein, I.J., Zhang, J., Han, W.Z.: Bi-metal interface-mediated defects distribution in neon ion bombarded Cu/Ag nanocomposites. Scr. Mater. 171, 1–5 (2019)
5. Hsu, H.L., Lee, H., Wang, C.W., Liang, C., Chen, C.M.: Impurity evaporation and void formation in Sn/Cu solder joints. Mater. Chem. Phys. 225, 153–158 (2019)
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