Debonding of a thermoelastic material from a rigid substrate at any constant speed: thermal relaxation effects
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Computational Mechanics
Link
http://link.springer.com/content/pdf/10.1007/s00707-006-0334-7.pdf
Reference28 articles.
1. Transonic crack growth along a bimaterial interface: An investigation of the asymptotic structure of near-tip fields
2. Intersonic crack growth in bimaterial interfaces : an investigation of crack face contact
3. Shear dominated transonic interfacial crack growth in a bimaterial-I. Experimental observations
4. Shear dominated transonic interfacial crack growth in a bimaterial I-II. Asymptotic fields and favorable velocity regimes
5. Highly transient elastodynamic crack growth in a bimaterial interface: Higher order asymptotic analysis and optical experiments
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