Improvement for adhesion of thin metal films on ceramics by ion bombardment and the application to metal

Improvement for adhesion of thin metal films on ceramics by ion bombardment and the application to metal—ceramic joining

Published:1986-04 Issue:4 Volume:5 Page:381-383
ISSN:0261-8028
Container-title:Journal of Materials Science Letters
language:en
Short-container-title:J Mater Sci Lett

Author:

Noda Shoji,Doi Haruo,Yamamoto Nobuyuki,Hioki Tatsumi,Kawamoto Jun'ichi,Kamigaito Osami

Publisher

Springer Science and Business Media LLC

Subject

General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/BF01672332.pdf

Reference7 articles.

1. L. E. COLLINS, P. A. O'CONNELL, J. G. PERKINS, F. R. PONTET and P. T. STROUD,Nucl. Instrum. Meth. 92 (1971) 455.

2. R. A. MOLINE, in “Ion Implantation in Semiconductors”, edited by F. Chernow, J. A. Borders and D. K. Brice (Plenum, New York, 1977) pp. 319–331.

3. L. E. COLLINS, J. G. PERKINS and P. T. STROUD,Thin Solid Films 4 (1969) 41.

4. C. WEAVER,J. Vac. Sci. Technol. 12 (1975) 18.

5. J. F. GIBBONS, W. S. JOHNSON and S. W. MYLROIE, “Projected Range Statistics”, 2nd edn (Dowden Hutchinson and Ross, Stroudsburg, Pennsylvania, 1975).

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