1. H.H. Manko, ‘Solders and Soldering’ (2nd ed.), New York, 1979, pp. 17–18
2. C.J. Thwaites, ‘Some aspects of soldering gold surfaces’,Electroplat. Met. Finish., 1973,26(8) 10–15
3. C.J. Thwaites, ‘Some aspects of soldering gold surfaces’,Electroplat. Met. Finish., 1973,26(9), 21–26
4. G.M. Green, ‘The soft soldering of gold plated surfaces. A review’,STL Report No. MECI/R446/1974/806, March 1974
5. W.G. Bader, ‘Dissolution of Au, Ag, Pt, Cu and Ni in a molten tin-lead solder’,Welding J., Res. Suppl., 1969,48, 551S-57S