Évolution prévisionnelle des structures et des technologies pour composants électroniques au silicium

Author:

Borel Joseph

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering

Reference6 articles.

1. Nishi (Y.),Taniguchi (K.),Matsunaga (I.). Technology and modeling forMos ic/Vlsi’s state of the art. Proc. of the 14th European solid state device research. Conf. 10–13 sept. 1984. France. North-Holland, Netherl. (1985), pp. 16–32.

2. Hamdi (A. H.), McDaniel (F. D.).Vlsi materials: a comparison between buried oxideSoi andSos.IEEE Trans. NS, USA (avr. 1983),30, n∘ 2.

3. Cohen (C. L.).Lsi in 3-D coming soon. Electronics Week, USA (avr. 1985),8, p. 16.

4. Nakamura (T.),Takahashi (S.),Kure (T.),Okabe (T.),Miyazaki (T.),Nagata (M.). Self-aligned transistor with sidewall base electrode.IEEE Trans. ED, USA (avr. 1982),29, n∘ 4, pp. 596–600.

5. Dennard (R. H.),Wordeman (M. R.). Solide state devices. Proc. 14th European solid state device. Conf. 10–13 sep. 1984.North-Holland, Nstherl. (1985), pp. 16–32.

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