1. Brady TA, O’Connell S, Tanskanen P et al (2003) Material composition profiles of select IT components, a design for environment project with the high density packaging user group (HDPUG). Proc IEEE Int Symp Electron Environ, 19–22 May, Boston, MA, pp 125–130
2. Turbini LJ, Munie GC, Bernier D et al (2001) Examining the environmental impact of leadfree soldering alternatives. IEEE Trans Electron Packag Manuf 24:4–9
3. Müller J, Griese H, Schischke K (2005) Transition to lead-free soldering – a great change for a better understanding of materials and processes and green electronics. Proc Int Conf Asian Green Electron, 15–18 March, Shanghai, China, pp 33–36
4. Müller J, Griese H, Reichl H (1999) Reduced environmental impacts by lead free electronic assemblies? Proc Int Summit Lead-free Electron Assemblies IPCWorks '99, 26–28 Oct, Minneapolis, MN
5. Niu X, Li Y (2007) Treatment of waste printed wire boards in electronic waste for safe disposal. J Hazard Mater 145:410–416