Porous Silicon as a Sacrificial Layer in Production of Silicon Diaphragms by Precision Grinding
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Publisher
Springer US
Link
http://link.springer.com/content/pdf/10.1007/978-1-4757-5791-0_2
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1. Investigation of precision grinding process for production of silicon diaphragms;Journal of Micro/Nanolithography, MEMS, and MOEMS;2002-07-01
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