Author:
Brodie Ivor,Muray Julius J.
Reference137 articles.
1. W. M. Moreau, Semiconductor Lithography, Plenum, N.Y. (1988)
2. B. J. Lin, Deep UV lithography, J. Vac. Sci. Technol. 12(6), 1317 (November-December, 1975 ).
3. M. C. King, Future development for 1:1 projection photolithography, IEEE Trans. Electron Devices ED-26(4), 705 (April, 1979); M. C. King and E. S. Muraski, New generation of 1:1 optical projection-mask aligners, Proc. SPIE
174, 70 (1979); J. W. Bossung and E. S. Muraski, Optical advances in projection lithography, Proc. SPIE
135, 16 (1978); J. W. Bossung, Projection printing characterization, Proc. SPIE
100, 80 (1977).
4. H. Binder and M. Lacombat, Step-and-repeat projection printing for VLSI circuit fabrication, IEEE Trans. Electron Devices ED-26(4), 698 (April, 1979); G. L. Resor and A. C. Tobey, The role of direct step-on-the-wafer in microlithography strategy for the ‘80’s, Solid State Technol. 22(8), 101 (August, 1979); H. E. Mayer and E.W. Leobach, A new step-by-step aligner for very large scale integration (VLSI) production, Proc. SPIE
221, 9 (1980).
5. M. C. King and M. R. Goldrick, Optical MTF evaluation techniques for microelectronic printers, Solid State Technol. 19(2), 37 (February, 1977 ).