1. Knoedler, A. “Pulse Plating Processes in Gold Plating: Status and Prospects,” Galcan.otechnik, 72, 11: 1167–1174 (1981).
2. Puippe, J. C. and N. Ibl. “Influence of Charge and Discharge of Electric Double Layer in Pulse Plating,” J. Appt. Electrochem.
10, 6: 774–784 (1980).
3. Wan, C. C., C. S. Tong and B. Y. Wu. “Effect of Pulsed Current on Heavy Gold Plating,” K’o Hsneh Fa Chan. Yueh K’an
8, 9: 782–797 (1980).
4. Stimetz, C. J. and M. F. Stevenson, “Pulse Plating of Nickel Deposits,” A nn. Tech. Cont. 67. Sess. L: L1–15, AES (1980).
5. Morrissey, R. J. and A. M. Weisberg, “Further Studies on Porosity in Gold Electrodeposits,” Trans. inst. Metal Finish.
58, 3: 97–103 (1980).