1. T. Stanley, Proceedings of the IEEE Intemational SOI Conference, p. 166, 1992
2. T. Stanley, in “Silicon-on-Insulator Technology and devices”, Ed. by. S. Cristoloveanu, The Electrochemical Society, Proceedings Vol. 94–11, p. 441, 1994
3. T.D. Stanley, Proceedings of the Second Intemational Symposium on “Semiconductor Wafer Bonding: Science, Technology, and Applications”, Ed. by M.A. Schmidt, C.E. Hunt, T. Abe, and H. Baumgart, The Electrochemical Society, Proceedings Vol. 93–29, p. 303, 1993
4. Y. Kado, H. Inokawa, Y. Okazaki, T. Tsuchiya, Y. Kawai, M. Sato, Y. Sakakibara, S. Nakayama, H. Yamada, M. Kitamura, S. Nakashima, K. Nishimura, S. Date, M. Ino, K. Takeya, and T. Sakai, Technical Digest of IEDM, p. 635, 1995
5. B.Y. Hwang, M. Racanelli, M. Huang, J. Foerstner, S. Wilson, T. Wetteroth, S. Wald, J. Rugg, and S. Cheng, Extended Abstracts of the International Conference on Solid-State Devices and Materials, Yokohama, p. 268, 1994