Author:
Choi Sung R.,Gyekenyesi John P.
Reference38 articles.
1. F. F. Lange, High-Temperature Strength Behavior of Hot-Pressed Si3N4: Evidence for Subcritical Crack Growth, J Am. Ceram. Soc., 57, 84–87 (1974).
2. G. Evans and S. M. Wiederhorn, Crack Propagation and Failure Prediction in Silicon Nitride at Elevated Temperatures, J. Mater. Sci., 9, 270–278 (1974).
3. R. Kossowsky, D. G. Miller, and E. S. Diaz, Tensile and Creep Strengths of Hot-Pressed Si3N4, J. Mater. Sci., 10, (1975), 983–997 (1978).
4. J. E. Weston and P. L. Pratt, Crystallization of Grain Boundary Phases in Hot-Pressed Silicon Nitride Materials, J. Mater. Sci., 13, 2147–2156 (1978).
5. N. J. Tighe, The Structure of Slow Crack Growth Interfaces in Silicon Nitride, J. Mater. Sci., 13, 1455–1463 (1978).
Cited by
6 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献