Solute Effects on Grain Boundary Electromigration and Diffusion-Reference-Cited by-同舟云学术

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Solute Effects on Grain Boundary Electromigration and Diffusion

Published:1972 Issue: Volume: Page:339-370
ISSN:
Container-title:The Nature and Behavior of Grain Boundaries
language:
Short-container-title:

Author:

d’Heurle F. M.,Gangulee A.

Publisher

Springer US

Link

http://link.springer.com/content/pdf/10.1007/978-1-4757-0181-4_14

Reference87 articles.

1. W. Jost,‘Diffusion in Solids, Liquids and Gases’, Academic Press, New York, (1952), p. 324.

2. J. Verhoeven, Metal, Reviews, 8, 311–368 (1963).

3. H. B. Huntington, TMS-AIME, 245, 2571–2579 (1969).

4. Y. Adda and J. Philibert, ‘La Diffusion dans les Solides’, Presses Universitaires, Paris (1966), p. 893.

5. F. M. d’Heurle, Proc. IEEE, 59, 1409–1418 (1971).

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1. Phase-field modeling of grain-boundary grooving and migration under electric current and thermal gradient;Acta Materialia;2018-07

2. Reactive Phase Formation: Some Theory and Applications;Diffusion Processes in Advanced Technological Materials;2005

3. The role of grain boundary structure on electromigration-induced drift in pure Al and Al(0.5wt% Cu);Scripta Materialia;1998-09

4. Electromigration and Diffusion in Short Al-Ni-Cr Lines;MRS Proceedings;1998-01

5. The effect of grain orientation on the relaxation of thermomechanical stress and hillock growth in AI-1%Si conductor layers on silicon substrates;Journal of Electronic Materials;1993-06

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