Thermal Contraction Coefficient Measurement Technique of Several Materials at Low Temperatures Using Electronic Speckle Pattern Interferometry-Reference-Cited by-同舟云学术

Thermal Contraction Coefficient Measurement Technique of Several Materials at Low Temperatures Using Electronic Speckle Pattern Interferometry

Published:1998 Issue: Volume: Page:359-366
ISSN:
Container-title:Advances in Cryogenic Engineering Materials
language:
Short-container-title:

Author:

Nakahara S.,Nishida S.,Hisada S.,Fujita T.

Publisher

Springer US

Link

http://link.springer.com/content/pdf/10.1007/978-1-4757-9056-6_47

Reference9 articles.

1. K. A. Stetson, The use of heterodyne speckle photogrammetry to measure high temperature strain distributions, Proc. Soc. Photo-Opt. Instrum. Eng., 370: 46–54 (1983).

2. W. Jiang, A. Kawasaki, K. Date, and R. Watanabe, Measurement of thermal expansion coefficient of Mo/PSZ sintered composites by laser speckle photography. J. Japan Inst. Metals, 58: 835–841 (1994) (in Japanese).

3. F. Salazar and F. GascOn, Thermal expansion coefficient measurement by double- exposure speckle photography, Optics Communications, 103: 235–244 (1993).

4. S. Nakahara, Y. Maeda, K. Matsumura, S. Hisada, T. Fujita, and K. Sugihara, Deformation measurements of materials at low temperatures using laser speckle photography method, Advances in Cryogenic Engineering (Materials), 38: 85–92 (1992).

5. S. R. Sirohi, in: Speckle Metrology, Marcel Dekker. Inc., New York (1993) 67. 100.

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