1. D. Steinberg, Vibration Analysis for Electronic Equipment, 2nd edn, John Wiley, 1988.
2. E. Suhir, Dynamic response of microelectronics and photonics systems to shocks and vibrations, International Conference on Electronic Packaging, INTERPack’97, Hawaii, June 15–19, 1997.
3. JEDEC Standard JESD22-B104-B, Mechanical Shock, 2001.
4. JEDEC Standard JESD22-B111, Board Level Drop Test Method of Components for Handheld Electronic Products, 2003.
5. S. Goyal, E.K. Buratynski, and G.W. Elko, Shock-protection suspension design for printed circuit board, Proceedings of SPIE, 4217, 2002.