Developments in lead-free solders and soldering technology-Reference-Cited by-同舟云学术

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Developments in lead-free solders and soldering technology

Published:2002-06 Issue:6 Volume:54 Page:25-25
ISSN:1047-4838
Container-title:JOM
language:en
Short-container-title:JOM

Author:

Kang Sung K.

Publisher

Springer Science and Business Media LLC

Subject

General Engineering,General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/BF02701844.pdf

Reference7 articles.

1. S.K. Kang and A. Sarkhel,J. Electron. Materials, 23 (1994), p. 701.

2. I.E. Anderson,Proc. NEPCON West’96 Conf. Vol. 2 (1996), p. 882.

3. “Lead-Free Solder Project Final Report” (Ann Arbor, MI: NCMS, August 1997).

4. R. Ninomiya et al.,Proc. InterPACK’97, vol. 2 (1997), p. 1329.

5. K. Seelig and D. Suraski, Proc. 50th Electron. Comp. & Tech. Conf. (2000), p. 1405.

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