Characterization of Dislocations in hcp $$^4\hbox {He}$$ by Torsional Oscillator and Thermal Conductivity Measurements

Author:

Brazhnikov M. Yu.,Mukharsky Y. M.,Golov A. I.ORCID

Abstract

AbstractWe apply two complementary techniques for the characterization of mobile dislocations in samples of hcp $$^4\hbox {He}$$ 4 He  with the concentration of $$^3\hbox {He}$$ 3 He  $$\sim 3\times 10^{-7}$$ 3 × 10 - 7 , grown by the blocked capillary method at molar volume 19.5 $$\hbox {cm}^3\,\hbox {mol}^{-1}$$ cm 3 mol - 1 , before and after annealing at temperatures 1.8–2.0 K, and also after work hardening by high-amplitude twisting at 0.03 K and successive recovery at 0.5–1.0 K. The first technique relies on the elastic response of solid helium to oscillatory twisting at frequencies 161 Hz and 931 Hz at temperatures below 1 K, where this response is affected by the presence of mobile dislocations with variable amounts of trapped $$^3\hbox {He}$$ 3 He impurities. Monitoring the non-equilibrium amplitude dependence after moderate forcing allows to compute the length distribution n(L) of mobile dislocations (Iwasa in J Low Temp Phys 171:30, 2013; Fefferman et al. in Phys Rev B 89:014105, 2014). We also test methods of determining n(L) from the equilibrium temperature dependence of either real or imaginary part of the shear modulus at small strain amplitudes, based on the values of the damping force measured by Fefferman et al. [2]. The second technique utilizes measurements of thermal conductivity at temperatures below 0.4 K, i.e., of the dislocation-limited mean free path of thermal transverse phonons (Greenberg and Armstrong in Phys Rev B 20:1049, 1979; Armstrong et al. in Phys Rev B 20:1061, 1979). During a prolonged AC-twisting at a high amplitude of strain exceeding the yield stress, long dislocations disappear being replaced by many short ones which remain mobile. However, upon stopping this twisting, the majority of dislocations become immobilized until the sample is warmed up above 0.5 K to speed-up the recovery of dislocations to their mobile state (Day et al. in Phys Rev B 79:214524, 2009; Beamish and Franck in Phys Rev B 26:6104, 1982). This is different from the immobilization of dislocations by trapped $$^3\hbox {He}$$ 3 He  impurities, routinely observed at smaller strain amplitudes, which is characterized by much shorter relaxation times to effectively un-trap $$^3\hbox {He}$$ 3 He  atoms and make dislocations mobile again. We investigated the dynamics of the recovery of cold-worked samples, during which short segments quickly disappear, while the longest one appear after longer annealing times; the activation energy was estimated to be 22 K—pointing at the thermal vacancy-assisted process. A complementary characterization by the scattering rate of thermal transverse phonons off crystalline defects rules out non-interacting mobile dislocations as the dominant scatterer. The main conclusion is that while many properties of the sample are consistent with the theory of Granato and Lücke of isolated gliding dislocations (Granato and Lücke in J Appl Phys 27:583, 1956), several observations at low temperatures ($$^3\hbox {He}$$ 3 He -independent immobilization of dislocations after stopping high-amplitude twisting, sporadic avalanche-like relaxation of strain, flat temperature dependence of the phonon scattering rate) point at the presence of interacting dislocations, probably arranged into dislocation walls.

Funder

Engineering and Physical Sciences Research Council

Publisher

Springer Science and Business Media LLC

Subject

Condensed Matter Physics,General Materials Science,Atomic and Molecular Physics, and Optics

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3