Unveiling thermal properties and pump-out blocking in diamond/GaInSn composites as thermal interface materials
Author:
Funder
Beijing Natural Science Foundation
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Metals and Alloys,Physical and Theoretical Chemistry,Condensed Matter Physics
Link
https://link.springer.com/content/pdf/10.1007/s12598-023-02331-y.pdf
Reference54 articles.
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3. Sharma RK, Bash CE, Patel CD, Friedrich RJ. Balance of power: dynamic thermal management for internet data centers. IEEE Internet Comput. 2005;9(1):42. https://doi.org/10.1109/MIC.2005.10.
4. Waldrop M. The chips are down for Moore’s law. Nature. 2016;530(7589):144. https://doi.org/10.1038/530144a.
5. Pan D, Yang G, Abo-Dief H, Dong J, Su F, Liu C, Li Y, Xu B, Murugadoss V, Naik N, El-Bahy S, El-Bahy Z, Huang M, Guo Z. Vertically aligned silicon carbide nanowires/boron nitride cellulose aerogel networks enhanced thermal conductivity and electromagnetic absorbing of epoxy composites. Nano-Micro Lett. 2022;14:118. https://doi.org/10.1007/s40820-022-00863-z.
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